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- 介孔二氧化硅比表面积、总孔容及孔径标准物质,介孔二氧化硅比表面积、总孔容及孔径标准物质 ,比表面积:511m2/g,总孔容:0.806cm3/g,平均孔径:6.31nm
介孔二氧化硅比表面积、总孔容及孔径标准物质,介孔二氧化硅比表面积、总孔容及孔径标准物质 ,比表面积:511m2/g,总孔容:0.806cm3/g,平均孔径:6.31nm
(The order shall be subject to the English name)
Name:
Silicon dioxide
CAS No.:
60676-86-0
Molecular formula:
SiO₂
Molecular weight:
60.08
Density:
2.6 g/mL at 25°C(lit.)
MeltingPoint:
1610°C(lit.)
BoilingPoint:
2950°C
Preservation conditions:
低温,干燥,密封
InChIKey:
VYPSYNLAJGMNEJ-UHFFFAOYSA-N
InChI:
InChI=1S/O2Si/c1-3-2
Pubchem ID:
Grade of hazardous chemicals:
GHS:
HazardStatement:
H319; H335; H373
WarningStatement:
P261; P305 + P351 + P338
DangerCode:
R48/20
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